Pixel Pitch（mm)- 1.5/P1.25/P1.8 Panel Material -Die Casting Aluminum Type of LED- Fully Flip Chip COB COB Technology The bare chip is connected to the PCB board using either conductive or non-conductive adhesive. Afterwards, the leads and the chip are covered with adhesive. The complete flip-chip COB technology offers the following advantages. COB (chip-on-board) packaging technology fixes the RGB chip directly on the LED PCB board and then makes the LED display module through the overall die-packaging, which is equivalent to super-sized LEDs with multi-pixels. Compared with SMD, COB technology attaches the light-emitting chips to the PCB board directly, simplifies the steps of the process, and achieves strong protection effects at the same time. The challenge is that the COB process is relatively difficult and expensive. VIDEO WALL CONTROLLER 1) The controller must have quality HDMI input /output with various interfaces etc 2) Must support higher resolutions or support COB and other details, 3) The controller can be upgraded using a local USB-based firmware update etc.